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1. product profile 1.1 general description 130 w ldmos power transistor for base st ation applications at frequencies from 2000 mhz to 2200 mhz. [1] test signal: 3gpp; test model 1; 64 dpch; par = 8.4 db at 0.01 % probability on ccdf; carrier spacing 5 mhz. [2] test signal: 3gpp; test model 1; 64 dpch; par = 7.2 db at 0.01 % probability on ccdf. 1.2 features and benefits ? excellent ruggedness ? high efficiency ? low r th providing excellent thermal stability ? designed for broadband operation (2000 mhz to 2200 mhz) ? lower output capacitance for improved performance in doherty applications ? designed for low memory effect s providing excellent digita l pre-distortion capability ? internally matched for ease of use ? integrated esd protection ? compliant to directive 2002/ 95/ec, regarding restriction of hazardous substances (rohs) 1.3 applications ? rf power amplifiers for w-cdma base statio ns and multi carrier applications in the 2000 mhz to 2200 mhz frequency range blf7g22l-130; BLF7G22LS-130 power ldmos transistor rev. 4 ? 20 january 2011 product data sheet table 1. typical performance typical rf performance at t case = 25 c in a common source class-ab production test circuit. mode of operation f i dq v ds p l(av) g p d acpr (mhz) (ma) (v) (w) (db) (%) (dbc) 2-carrier w-cdma 2110 to 2170 950 28 30 18.5 32 ? 32 [1] 1-carrier w-cdma 2110 to 2170 950 28 33 18.5 33 ? 39 [2]
blf7g22l-130_7g22ls-130 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights re served. product data sheet rev. 4 ? 20 january 2011 2 of 15 nxp semiconductors blf7g22l-130; BLF7G22LS-130 power ldmos transistor 2. pinning information [1] connected to flange. 3. ordering information 4. limiting values table 2. pinning pin description simplified outline graphic symbol blf7g22l-130 (sot502a) 1drain 2gate 3source [1] BLF7G22LS-130 (sot502b) 1drain 2gate 3source [1] 3 2 1 sym11 2 1 3 2 3 2 1 sym11 2 1 3 2 table 3. ordering information type number package name description version blf7g22l-130 - flanged ldmost ceramic package; 2 mounting holes; 2 leads sot502a BLF7G22LS-130 - earless flanged ldmost ceramic package; 2 leads sot502b table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v ds drain-source voltage - 65 v v gs gate-source voltage ? 0.5 +13 v i d drain current - 28 a t stg storage temperature ? 65 +150 c t j junction temperature - 225 c
blf7g22l-130_7g22ls-130 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights re served. product data sheet rev. 4 ? 20 january 2011 3 of 15 nxp semiconductors blf7g22l-130; BLF7G22LS-130 power ldmos transistor 5. thermal characteristics 6. characteristics 7. test information 7.1 ruggedness in class-ab operation the blf7g22l-130 and BLF7G22LS-130 are ca pable of withstanding a load mismatch corresponding to vswr = 10 : 1 through all phases under the following conditions: v ds =28v; i dq =950ma; p l = 130 w (cw); f = 2110 mhz. table 5. thermal characteristics symbol parameter conditions typ unit r th(j-c) thermal resistance from junction to case t case =80 c; p l =30w 0.35 k/w table 6. characteristics t j = 25 c unless otherwise specified. symbol parameter conditions min typ max unit v (br)dss drain-source breakdown voltage v gs =0v; i d =1.5ma 65 - - v v gs(th) gate-source threshold voltage v ds = 10 v; i d = 150 ma 1.3 1.8 2.3 v i dss drain leakage current v gs =0v; v ds =28v - - 5 a i dsx drain cut-off current v gs =v gs(th) + 3.75 v; v ds =10v 25 29.5 - a i gss gate leakage current v gs =11v; v ds = 0 v - - 450 na g fs forward transconductance v ds =10v; i d =7.5a - 10 11 s r ds(on) drain-source on-state resistance v gs =v gs(th) + 3.75 v; i d =5.25a - 0.1 0.16 table 7. functional test information mode of operation: 2-carrier w-cdma; par = 8.4 db at 0.01 % probability on the ccdf; 3gpp test model 1; 64 dpch; f 1 =2112.5mhz; f 2 = 2117.5 mhz; f 3 = 2162.5 mhz; f 4 = 2167.5 mhz; rf performance at v ds =28v; i dq = 950 ma; t case =25 c; unless otherwise specified; in a class-ab production test circuit. symbol parameter conditions min typ max unit p l(av) average output power - 30 - w g p power gain p l(av) =30w 17 18.5 - db rl in input return loss p l(av) =30w - ? 15 ? 9db d drain efficiency p l(av) =30w 29 32 - % acpr adjacent channel power ratio p l(av) =30w - ? 31 ? 28 dbc
blf7g22l-130_7g22ls-130 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights re served. product data sheet rev. 4 ? 20 january 2011 4 of 15 nxp semiconductors blf7g22l-130; BLF7G22LS-130 power ldmos transistor 7.2 impedance information table 8. typical impedance information i dq = 950 ma; main transistor v ds =28v. z s and z l defined in figure 1 . f (mhz) z s ( ) z l ( ) 2050 1.3 ? j3.6 2.2 ? j2.6 2140 1.9 ? j4.2 2.0 ? j2.6 2230 3.1 ? j4.7 1.9 ? j2.8 fig 1. definition of transistor impedance 001aaf05 9 drain z l z s gate
blf7g22l-130_7g22ls-130 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights re served. product data sheet rev. 4 ? 20 january 2011 5 of 15 nxp semiconductors blf7g22l-130; BLF7G22LS-130 power ldmos transistor 7.3 1 tone cw v ds = 28 v; i dq = 950 ma. (1) f = 2110 mhz (2) f = 2140 mhz (3) f = 2170 mhz v ds = 28 v; i dq = 950 ma. (1) f = 2110 mhz (2) f = 2140 mhz (3) f = 2170 mhz fig 2. power gain as a function of load power; typical values fig 3. drain efficiency as a function of load power; typical values v ds = 28 v; i dq = 950 ma. (1) f = 2110 mhz (2) f = 2140 mhz (3) f = 2170 mhz fig 4. input return loss as a function of load power; typical values p l (w) 0 160 120 40 80 001aal341 16 17 15 18 19 g p (db) 14 (1) (2) (3) p l (w) 0 160 120 40 80 001aal342 20 40 60 d (%) 0 (1) (2) (3) 001aal352 p l (w) 0 rl in (db) ? 30 ? 20 ? 10 070 30 60 40 50 10 20 (3) (2) (1)
blf7g22l-130_7g22ls-130 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights re served. product data sheet rev. 4 ? 20 january 2011 6 of 15 nxp semiconductors blf7g22l-130; BLF7G22LS-130 power ldmos transistor 7.4 1-carrier w-cdma test signal: 3gpp; test model 1; 64 dpch; par = 7.2 db at 0.01 % probability on ccdf. v ds = 28 v; i dq = 950 ma. (1) f = 2112.5 mhz (2) f = 2140 mhz (3) f = 2167.5 mhz v ds = 28 v; i dq = 950 ma. (1) f = 2112.5 mhz (2) f = 2140 mhz (3) f = 2167.5 mhz fig 5. power gain as a function of load power; typical values fig 6. drain efficiency as a function of load power; typical values v ds = 28 v; i dq = 950 ma. (1) f = 2112.5 mhz (2) f = 2140 mhz (3) f = 2167.5 mhz v ds = 28 v; i dq = 950 ma. (1) f = 2112.5 mhz (2) f = 2140 mhz (3) f = 2167.5 mhz fig 7. adjacent channel power ratio (5mhz) as a function of load power; typical values fig 8. peak-to-average power ratio as a function of load power; typical values 001aal345 p l (w) 090 60 30 17 18 16 19 20 g p (db) 15 (3) (2) (1) 001aal346 p l (w) 090 60 30 20 40 60 d (%) 0 (1) (2) (3) 001aal348 p l (w) 090 60 30 ? 40 ? 20 0 acpr 5m (dbc) ? 60 (1) (2) (3) 001aal347 p l (w) 090 60 30 4 2 6 8 pa r (db) 0 (1) (2) (3)
blf7g22l-130_7g22ls-130 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights re served. product data sheet rev. 4 ? 20 january 2011 7 of 15 nxp semiconductors blf7g22l-130; BLF7G22LS-130 power ldmos transistor 7.5 2-carrier w-cdma (5 mhz carrier spacing) test signal: 3gpp; test model 1; 64 dpch; par = 8.4 db at 0.01 % probability on ccdf. v ds = 28 v; i dq = 950 ma; carrier spacing 5 mhz. (1) f = 2115 mhz (2) f = 2140 mhz (3) f = 2165 mhz v ds = 28 v; i dq = 950 ma; carrier spacing 5 mhz. (1) f = 2115 mhz (2) f = 2140 mhz (3) f = 2165 mhz fig 9. power gain as a function of load power; typical values fig 10. drain efficiency as a function of load power; typical values v ds = 28 v; i dq = 950 ma; carrier spacing 5 mhz. (1) f = 2115 mhz (2) f = 2140 mhz (3) f = 2165 mhz fig 11. adjacent channel power ratio (5 mhz) as a function of load power; typical values 001aal351 p l (w) 20 g p (db) 15 17 19 16 18 070 30 60 40 50 10 20 (3) (2) (1) 001aal353 20 30 10 40 50 d (%) 0 p l (w) 070 30 60 40 50 10 20 (1) (2) (3) 001aal354 p l (w) 0 acpr 5m (dbc) ? 60 ? 40 ? 20 070 30 60 40 50 10 20 (1) (3) (2)
blf7g22l-130_7g22ls-130 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights re served. product data sheet rev. 4 ? 20 january 2011 8 of 15 nxp semiconductors blf7g22l-130; BLF7G22LS-130 power ldmos transistor 7.6 2-carrier w-cdma (1 0 mhz carrier spacing) test signal: 3gpp; test model 1; 64 dpch; par = 8.4 db at 0.01 % probability on ccdf. v ds = 28 v; i dq = 950 ma; carrier spacing 10 mhz. (1) f = 2117.5 mhz (2) f = 2140 mhz (3) f = 2162.5 mhz v ds = 28 v; i dq = 950 ma; carrier spacing 10 mhz. (1) f = 2117.5 mhz (2) f = 2140 mhz (3) f = 2162.5 mhz fig 12. power gain as a function of load power; typical values fig 13. drain efficiency as a function of load power; typical values v ds = 28 v; i dq = 950 ma; carrier spacing 10 mhz. (1) f = 2117.5 mhz (2) f = 2140 mhz (3) f = 2162.5 mhz v ds = 28 v; i dq = 950 ma; carrier spacing 10 mhz. (1) f = 2117.5 mhz (2) f = 2140 mhz (3) f = 2162.5 mhz fig 14. adjacent channel power ratio (5 mhz) as a function of load power; typical values fig 15. adjacent channel power ratio (10 mhz) as a function of load power; typical values 001aal355 p l (w) 20 g p (db) 15 17 19 16 18 070 30 60 40 50 10 20 (3) (2) (1) 001aal356 20 30 10 40 50 d (%) 0 p l (w) 070 30 60 40 50 10 20 (1) (2) (3) 001aal357 p l (w) 0 acpr 5m (dbc) ? 60 ? 40 ? 20 070 30 60 40 50 10 20 (1) (3) (2) 001aal358 p l (w) 0 acpr 10m (dbc) ? 60 ? 40 ? 20 070 30 60 40 50 10 20 (1) (3) (2)
blf7g22l-130_7g22ls-130 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights re served. product data sheet rev. 4 ? 20 january 2011 9 of 15 nxp semiconductors blf7g22l-130; BLF7G22LS-130 power ldmos transistor 7.7 test circuit see table 9 for list of components. the drawing is not to scale. fig 16. component layout c2 c1 r1 001aal35 9 BLF7G22LS-130 input v1 ro4350 30mil rsn BLF7G22LS-130 output v1 ro4350 30mil rsn c3 c8 c9 c11 c4 c7 c10 c5 c6 table 9. list of components see figure 16 for component layout. component description value remarks c1, c2, c3, c4, c5 multilayer ceramic chip capacitor 9.1 pf atc100b c6, c7 multilayer ceramic chip capacitor 220 nf avx1206 c8, c9, c10 multilayer cera mic chip capacitor 4.7 f; 50 v kemet c11 electrolytic capacitor 220 f; 63 v bc r1 smd resistor 6.2 philips 1206
blf7g22l-130_7g22ls-130 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights re served. product data sheet rev. 4 ? 20 january 2011 10 of 15 nxp semiconductors blf7g22l-130; BLF7G22LS-130 power ldmos transistor 8. package outline fig 17. package outline sot502a references outline version european projection issue date iec jedec jeita sot502a 99-12-28 03-01-10 0 5 10 mm scale flanged ldmost ceramic package; 2 mounting holes; 2 leads sot502 a p l a f b d u 2 h q c 1 3 2 d 1 e a c q u 1 c b e 1 m m w 2 unit a mm d b 12.83 12.57 0.15 0.08 20.02 19.61 9.53 9.25 19.94 18.92 9.91 9.65 4.72 3.43 c u 2 0.25 0.51 27.94 qw 2 w 1 f 1.14 0.89 u 1 34.16 33.91 l 5.33 4.32 p 3.38 3.12 q 1.70 1.45 ee 1 9.50 9.30 inches 0.505 0.495 0.006 0.003 0.788 0.772 d 1 19.96 19.66 0.786 0.774 0.375 0.364 0.785 0.745 0.390 0.380 0.186 0.135 0.01 0.02 1.100 0.045 0.035 1.345 1.335 0.210 0.170 0.133 0.123 0.067 0.057 0.374 0.366 h dimensions (millimetre dimensions are derived from the original inch dimensions) w 1 ab m m m
blf7g22l-130_7g22ls-130 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights re served. product data sheet rev. 4 ? 20 january 2011 11 of 15 nxp semiconductors blf7g22l-130; BLF7G22LS-130 power ldmos transistor fig 18. package outline sot502b references outline version european projection issue date iec jedec jeita sot502b 03-01-10 07-05-09 0 5 10 mm scale earless flanged ldmost ceramic package; 2 leads sot502 b a f b d u 2 l h q c 1 3 2 d 1 e d u 1 d e 1 m m w 2 unit a mm d b 12.83 12.57 0.15 0.08 20.02 19.61 9.53 9.25 19.94 18.92 9.91 9.65 4.72 3.43 c u 2 0.25 w 2 f 1.14 0.89 u 1 20.70 20.45 l 5.33 4.32 q 1.70 1.45 ee 1 9.50 9.30 inches 0.505 0.495 0.006 0.003 0.788 0.772 d 1 19.96 19.66 0.786 0.774 0.375 0.364 0.785 0.745 0.390 0.380 0.186 0.135 0.010 0.045 0.035 0.815 0.805 0.210 0.170 0.067 0.057 0.374 0.366 h dimensions (millimetre dimensions are derived from the original inch dimensions)
blf7g22l-130_7g22ls-130 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights re served. product data sheet rev. 4 ? 20 january 2011 12 of 15 nxp semiconductors blf7g22l-130; BLF7G22LS-130 power ldmos transistor 9. abbreviations 10. revision history table 10. abbreviations acronym description 3gpp third generation partnership project ccdf complementary cumulative distribution function cw continuous wave dpch dedicated physical channel esd electrostatic discharge ldmos laterally diffused metal oxide semiconductor ldmost laterally diffused metal oxide semiconductor transistor par peak-to-average power ratio rf radio frequency smd surface mounted device vswr voltage standing wave ratio w-cdma wideband code division multiple access table 11. revision history document id release date data sheet status change notice supersedes blf7g22l-130_7g22ls-130 v.4 20110120 product data sheet - BLF7G22LS-130 v.3 modifications: ? table 7 on page 3 : the maximum value of rl in has been corrected to ? 9 db. blf7g22l-130_7g22ls-130 v.3 20101118 product data sheet - BLF7G22LS-130 v.2 blf7g22l-130_7g22ls-130 v.2 20101004 product data sheet - BLF7G22LS-130 v.1 BLF7G22LS-130 v.1 20100202 product data sheet - -
blf7g22l-130_7g22ls-130 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights re served. product data sheet rev. 4 ? 20 january 2011 13 of 15 nxp semiconductors blf7g22l-130; BLF7G22LS-130 power ldmos transistor 11. legal information 11.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 11.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 11.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
blf7g22l-130_7g22ls-130 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights re served. product data sheet rev. 4 ? 20 january 2011 14 of 15 nxp semiconductors blf7g22l-130; BLF7G22LS-130 power ldmos transistor non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 11.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 12. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors blf7g22l-130; BLF7G22LS-130 power ldmos transistor ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 20 january 2011 document identifier: blf7g22l-130_7g22ls-130 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 13. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 thermal characteristics . . . . . . . . . . . . . . . . . . 3 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 test information . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.1 ruggedness in class-ab operation . . . . . . . . . 3 7.2 impedance information . . . . . . . . . . . . . . . . . . . 4 7.3 1 tone cw . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.4 1-carrier w-cdma . . . . . . . . . . . . . . . . . . . . . . 6 7.5 2-carrier w-cdma (5 mhz carrier spacing) . . . 7 7.6 2-carrier w-cdma (10 mhz carrier spacing) . . 8 7.7 test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 9 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 10 revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 11 legal information. . . . . . . . . . . . . . . . . . . . . . . 13 11.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 11.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 11.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 11.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 12 contact information. . . . . . . . . . . . . . . . . . . . . 14 13 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

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